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內(nèi)容簡(jiǎn)介
FEATURES
? Low profile package
? Ideal for automated placement
? Glass passivated chip junction
? Ultrafast recovery times for high efficiency
? Low forward voltage, low power loss
? Meets MSL level 1, per J-STD-020, LF maximum
peak of 260 °C
? Solder dip 260 °C, 40 s
? Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
TYPICAL APPLICATIONS
For use in secondary rectification and freewheeling for
ultrafast switching speeds ac-to-ac and dc-to-dc
converters in high temperature conditions for both
consumer and automotive applications.
下載說(shuō)明
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