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內(nèi)容簡介
FEATURES
? Molded high temperature encapsulation
? Improved thermal management incorporated
into design
? Ideal for all types of current sensing, voltage
division and pulse applications including
switching and linear power supplies,
instrumentation, power amplifiers
? Proprietary processing technique produces
extremely low resistance values (down to
0.001 Ω)
? All welded construction
? Solid metal nickel-chrome or manganese-copper alloy
resistive element with low TCR (< 20 ppm/°C)
? Solderable terminations
? Very low inductance 0.5 nH to 5 nH
? Excellent frequency response to 50 MHz
? Low thermal EMF (< 3 μV/°C)
? Integral heat sink not utilized for resistance values less
than 0.0075 Ω
? Compliant to RoHS Directive 2002/95/EC
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